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A stereo vision system for the inspection of IC bonding wires
Author(s) -
Ye Q. Z.,
Ong S. H.,
Han X.
Publication year - 2000
Publication title -
international journal of imaging systems and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.359
H-Index - 47
eISSN - 1098-1098
pISSN - 0899-9457
DOI - 10.1002/ima.1010
Subject(s) - subpixel rendering , artificial intelligence , computer vision , computer science , enhanced data rates for gsm evolution , matching (statistics) , filter (signal processing) , stereo camera , pixel , mathematics , statistics
We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the three‐dimensional (3D) profile of IC wire bonds. In our single‐camera–based setup, stereo views are obtained by rotating the IC chip under the CCD camera with a telecentric lens. The edges of the wires are detected using Petrou's line filter and the facet model applied to obtain subpixel edge localization. After linking edges to form meaningful curves, stereo matching is conducted between the two curve lists of a stereo pair. The height profiles of the wire bonds are obtained using the disparity equation derived from the imaging geometry. © 2001 John Wiley & Sons, Inc. Int J Imaging Syst Technol 11, 254–262, 2000