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A hillslope forest floor (duff) water budget and the transition to local control
Author(s) -
Keith D. M.,
Johnson E. A.,
Valeo C.
Publication year - 2010
Publication title -
hydrological processes
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.222
H-Index - 161
eISSN - 1099-1085
pISSN - 0885-6087
DOI - 10.1002/hyp.7697
Subject(s) - hydrology (agriculture) , soil water , infiltration (hvac) , environmental science , geology , moisture , precipitation , water content , forest floor , water table , soil science , groundwater , geotechnical engineering , geography , meteorology
Abstract The partially decomposed organic layer (duff: F and H layers) of the forest floor is an important boundary between the soil and atmospheric processes. Here we use both empirical data and a three‐dimensional coupled heat and water budget model to explain the duff hydrological hillslope shift between very brief wet periods when lateral flow in the duff and infiltration into the mineral soil occur and dry periods when evaporative flow dominates and both lateral and mineral soil flow are not important. The duff moisture transitions from wet to dry periods were the result of low lateral flow which moves liquid and water vapour only centimetres to metres, very rapidly and mostly in the H layer immediately after precipitation. During wet periods, the net lateral fluxes were negative on divergent areas and positive on convergent areas of the hillslope, leading to a net moisture loss in divergent areas and a net gain in convergent areas. The response to lateral flow in the H layer was more rapid than in the F layer. The transition from the lateral downwards flow to mineral soil to evaporative control was within approximately 48 h of precipitation. Canopy species and aspect were important with lodgepole pine, southwest aspect and 4‐cm deep duff controlled by evaporative processes while Engelmann spruce, northeast aspect and 30‐cm duff were more controlled by hillslope redistribution processes. Copyright © 2010 John Wiley & Sons, Ltd.