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Thermal performance of U‐shaped serpentine microchannel heat sink using various metal oxide nanofluids
Author(s) -
Sivakumar A.,
Sathiyamoorthi R.,
Alagumurthi N.,
Jayaseelan V.,
Sudhakar K.
Publication year - 2021
Publication title -
heat transfer
Language(s) - English
Resource type - Journals
eISSN - 2688-4542
pISSN - 2688-4534
DOI - 10.1002/htj.22020
Subject(s) - nanofluid , materials science , microchannel , ethylene glycol , thermal conductivity , laminar flow , heat sink , nanofluids in solar collectors , thermal resistance , thermal , chemical engineering , thermodynamics , composite material , nanoparticle , nanotechnology , physics , photovoltaic thermal hybrid solar collector , engineering
This study aims to evaluate the thermal performance and friction factor characteristics of the U‐shaped serpentine microchannel heat sink using three different nanofluids. Two distinct nanoparticles, namely Al 2 O 3 (alumina) and CuO (copper oxide), were used for the preparation of nanofluids using water and ethylene glycol (EG) as base fluids. Three nanofluids, namely nanofluid I (Al 2 O 3 + water), nanofluid II (CuO + water), and nanofluid III (CuO + EG), have been prepared. The results showed that the thermal conductivity of nanofluids was increased for all concentrations (from 0.01 to 0.3%), compared with base fluids. The theoretical values derived from the relationship between the Darcy friction factor showed a clear understanding of the fully developed laminar flow. Thermal resistance for nanofluid III was lower than other nanofluids, resulting in a higher cooling efficiency. The nanofluid mechanism and the geometry of the U‐shaped serpentine heat sink have led to the improvement in the thermal performance of electronic cooling systems.