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Hierarchic Supramolecular Interactions within Assemblies in Solution and in the Crystal of 2,3,6,7‐Tetrasubstituted 5,5′‐(Anthracene‐9,10‐diyl)bis[pyrimidin‐2‐amines]
Author(s) -
Balaban Teodor Silviu,
Eichhöfer Andreas,
Krische Michael J.,
Lehn JeanMarie
Publication year - 2006
Publication title -
helvetica chimica acta
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.74
H-Index - 82
eISSN - 1522-2675
pISSN - 0018-019X
DOI - 10.1002/hlca.200690037
Subject(s) - stacking , supramolecular chemistry , anthracene , chemistry , crystallography , amine gas treating , crystal structure , crystal (programming language) , molecule , absorption (acoustics) , photochemistry , materials science , organic chemistry , computer science , programming language , composite material
The title compounds 6 and 7 were synthesized in good yield ( Schemes 1 and 2 ), and their mode of assembly was studied both in solution, for the tetrakis(decyloxy) derivative 6 , and in the crystal, for the tetramethoxy analogue 7 . The pyrimidin‐2‐amine moieties of 6 and 7 can engage in three different supramolecular interactions: i ) metal ligation via one of the pyrimidine N‐atoms, ii ) cooperative double H‐bonding via the NH 2 group, and iii ) π–π ‐stacking interactions. In solution, coordination of the central Zn‐atom within the soluble porphyrinatozinc complex 19 leads to significant changes in the NMR and absorption spectra of 6 . In the absence of metal ligation, the next strongest interaction is H‐bonding which can operate in nonpolar or moderately polar solvents. In these cases, however, no stacking interaction or inclusion compounds could be put into evidence in the case of 6 by absorption, fluorescence, or NMR spectroscopies. The π ‐stacking interactions were only observed in the crystal of 7 in conjunction with double H‐bonding. Slightly disordered DMSO molecules are also H‐bonded to the NH 2 groups of 7 , perturbing the expected packing. The present study illustrates some of the challenges inherent to directing hierarchical assembly processes in the solid state.

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