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Planar High Temperature Heat Pipes for SOFC/SOEC Stack Applications
Author(s) -
Dillig M.,
Leimert J.,
Karl J.
Publication year - 2014
Publication title -
fuel cells
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.485
H-Index - 69
eISSN - 1615-6854
pISSN - 1615-6846
DOI - 10.1002/fuce.201300224
Subject(s) - stack (abstract data type) , materials science , planar , isothermal process , fabrication , heat transfer , heat spreader , transient (computer programming) , temperature gradient , heat pipe , thermodynamics , nuclear engineering , computer science , medicine , physics , computer graphics (images) , alternative medicine , pathology , quantum mechanics , engineering , programming language , operating system
Abstract Targeting transient operation of high temperature solid oxide cell (SOC) systems this paper proposes an enhanced heat management mechanism using planar high temperature heat pipes that can be integrated into the SOC‐stack structure. Flat heat pipes with thicknesses down to 4 mm filled with liquid alkali metals for almost isothermal 2D heat spreading, even for intense heat transfer rates, are demonstrated. A new pathway towards a temperature gradient shrinking in SOC‐stacks without using large amounts of additional air‐cooling is shown. The paper will present latest development results on design concepts, size reduced fabrication and filling procedure. An experimental study demonstrates the heat spreading capabilities and power limitations of planar heat spreaders for high temperature applications as in SOEC/SOFC stacks.