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Modelling of a pin‐fin heat converter with fluid cooling for power semiconductor modules
Author(s) -
Khorunzhii Igor,
Gabor Hubertus,
Job Reinhart,
Fahrner Wolfgang R.,
Baumann Heinrich
Publication year - 2003
Publication title -
international journal of energy research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.808
H-Index - 95
eISSN - 1099-114X
pISSN - 0363-907X
DOI - 10.1002/er.918
Subject(s) - heat sink , fin , computer cooling , heat transfer , heat transfer coefficient , mechanics , thermal resistance , convection , mechanical engineering , materials science , thermodynamics , water cooling , engineering , physics , thermal management of electronic devices and systems
This paper presents a way to design a finite‐element computer model of cooling system with a complicated geometry. The computer model is developed on the basis of a commercial software package ABAQUS. The steady state forced‐convective fluid cooling of a pin‐fin heat converter for power (∼1 kW heat power) semiconductor module has been investigated on the basis of computer simulation. A phenomenological equation has been used for calculation of the local value of the heat transfer coefficient for the liquid‐solid interface. The impacts of the thermal conductivity of the pin‐fin sink material, volume flow rate of the cooling liquid and geometrical design of the pin‐fin sink on the thermal resistance of the converter are shown. Copyright © 2003 John Wiley & Sons, Ltd.