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Distribution of microencapsulated phase change material on a plate, and inhibited build‐up of temperature in response to a constant heat flux
Author(s) -
Dey Arindam,
Ganguly Somenath
Publication year - 2021
Publication title -
international journal of energy research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.808
H-Index - 95
eISSN - 1099-114X
pISSN - 0363-907X
DOI - 10.1002/er.6602
Subject(s) - heat flux , materials science , constant (computer programming) , mechanics , phase change material , flux (metallurgy) , phase (matter) , temperature gradient , thermodynamics , phase change , convection , temperature measurement , natural convection , heat transfer , composite material , chemistry , meteorology , physics , computer science , organic chemistry , metallurgy , programming language
Summary The application of an inorganic phase change material (PCM) on instrument panel for temperature control is reviewed here through numerical simulation. A constant heat flux is provided on one face of the panel, and the inhibited temperature build‐up is studied for different modes of PCM placement. The distribution of microencapsulated PCM over the surface of the panel as embedded in the paint layer reduces the temperature gradient that is unavoidable for lumped placement at one location on the panel, which also affects the average temperature. The effect of the size of microcapsules, ranging from mm to μm scale on characteristics of temperature build‐up, is reported here under two different exposure conditions of upper surface of the paint layer, that is, natural convection and fully insulated condition. The cooling characteristics of the panel in the absence of heat flux are presented.