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Enhanced thermal conductivity of copper‐doped polyethylene glycol/urchin‐like porous titanium dioxide phase change materials for thermal energy storage
Author(s) -
Hou Junying,
Wang Yaya,
Liu Jingchun,
Zhao Jianguo,
Long Sifang,
Hao Jianjun
Publication year - 2019
Publication title -
international journal of energy research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.808
H-Index - 95
eISSN - 1099-114X
pISSN - 0363-907X
DOI - 10.1002/er.5045
Subject(s) - materials science , polyethylene glycol , thermal conductivity , titanium dioxide , copper , composite number , porosity , peg ratio , composite material , chemical engineering , phase change material , thermal stability , titanium , thermal , metallurgy , physics , meteorology , engineering , finance , economics
Summary A composite phase change material (PCM) of copper‐doped polyethylene glycol (PEG) 2000 impregnated urchin‐like porous titanium dioxide (TiO 2 ) microspheres (PEG/TiO 2 ) was successfully synthesised. The urchin‐like porous TiO 2 structures contain hollow cavities that can provide a high PEG loading capacity of up to 80 wt%. Copper nanoparticles were uniformly dispersed on the outer and inner surfaces of the 0.8PEG/TiO 2 as additives to enhance the thermal conductivity of the composite PCM. The latent heat of the Cu/PEG/TiO 2 porous composite PCM reached 133.8 J/g, and the thermal conductivity was 0.58 W/(mK), which was 152.2% higher than that of TiO 2 and 38.1% higher than 0.8PEG/TiO 2 . Moreover, the Cu/PEG/TiO 2 porous composite PCM has excellent thermal stability and reliability.