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Computational study of effects of contact resistance on a large‐scale vanadium redox flow battery stack
Author(s) -
Jung Seunghun,
Choi Byungchul,
Park Suhan,
Lee DongWeon,
Kim YoungBae,
Kim Soowhan
Publication year - 2019
Publication title -
international journal of energy research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.808
H-Index - 95
eISSN - 1099-114X
pISSN - 0363-907X
DOI - 10.1002/er.4453
Subject(s) - contact resistance , stack (abstract data type) , materials science , flow battery , composite material , vanadium , stiffness , mechanical engineering , forensic engineering , structural engineering , battery (electricity) , engineering , metallurgy , computer science , power (physics) , thermodynamics , physics , programming language , layer (electronics)
Summary Computational models are developed to allow for a deeper understanding of design factors that affect the lifetime of a vanadium redox flow battery (VRFB) stack, particularly related with the contact‐resistance issue of end cells in a large‐scale stack. A simplified microcontact‐resistance model and a physics‐based macrocontact‐resistance model are constructed to investigate the effect of contact resistance on the performance and longevity of VRFB stacks. A microcontact‐resistance model predicts significant heat accumulation in the current‐collector plate that can result in irreversible damage of plastic materials and an electrical‐voltage loss if the contact resistance is not properly engineered in the stack design. Furthermore, the physics‐based macrocontact‐resistance model investigates abrupt voltage and current distortion in the bipolar plate that is in imperfect contact with the current collector; this results in the local corrosion of the bipolar plate. To ensure a long lifetime of VRFBs, a stack design with minimal contact resistance (less than 0.1 Ω cm 2 ) is required. The structural design of the endplate as well as the selection of a high‐stiffness material is critical to mitigate the bending issue and reduce contact resistance.