Premium
A seismic retrofit method by connecting viscous dampers for microelectronics factories
Author(s) -
Hwang JennShin,
Wang ShiangJung,
Huang YinNan,
Chen JayFu
Publication year - 2007
Publication title -
earthquake engineering and structural dynamics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.218
H-Index - 127
eISSN - 1096-9845
pISSN - 0098-8847
DOI - 10.1002/eqe.689
Subject(s) - damper , microelectronics , damping ratio , vibration , structural engineering , engineering , damping torque , vibration control , viscous damping , physics , acoustics , electrical engineering , direct torque control , voltage , induction motor
Abstract The implementation of viscous dampers to microelectronics factories has been previously proved not to affect the micro‐vibration of the factories in operation so that the vibration‐sensitive manufacturing process will not be interfered. Therefore, a seismic retrofit strategy which employs the viscous dampers installed in between the exterior and interior structures of the ‘fab’ structure is proposed in the study. The design formulas corresponding to the proposed retrofit method are derived using the non‐proportional damping theory. Based on the study, it is found that the added damping ratio to the fab structure depends greatly on the frequency ratio of the two structures in addition to the damping coefficients of the added dampers. Outside the bandwidth of the frequency ratio in which the added damping ratio is very sensitive to the variation of the frequency ratio, the added damping ratio can be well captured using the classical damping theory. Copyright © 2007 John Wiley & Sons, Ltd.