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Effective dismantling of waste printed circuit board assembly with methanesulfonic acid containing hydrogen peroxide
Author(s) -
Zhang Xiaojiao,
Guan Jie,
Guo Yaoguang,
Cao Yonghai,
Guo Jiang,
Yuan Hao,
Su Ruijing,
Liang Bo,
Gao Guilan,
Zhou Yuan,
Xu Jinqiu,
Guo Zhanhu
Publication year - 2017
Publication title -
environmental progress and sustainable energy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.495
H-Index - 66
eISSN - 1944-7450
pISSN - 1944-7442
DOI - 10.1002/ep.12527
Subject(s) - methanesulfonic acid , printed circuit board , hydrogen peroxide , leaching (pedology) , sulfuric acid , dissolution , tin , materials science , depolymerization , electronic equipment , waste management , chemistry , engineering , chemical engineering , metallurgy , environmental science , organic chemistry , electrical engineering , soil science , soil water
Dismantling of waste printed circuit boards (WPCBs) is of great importance in the recycling chain of electronic wastes (e‐wastes), since there are lots of high‐value components and toxic substances contained in the WPCBs. In this work, effective dismantling was achieved by dissolving the lead‐tin solder into a leachant containing methanesulfonic acid (MSA) and H 2 O 2 . Different concentrations of H 2 O 2 and MSA as well as leaching time were investigated. The final optimization experiment scheme was obtained from the simulation with the help of Design‐Expert 8.0.6 software. A leachant containing 3.5 mol/L MSA and 0.5 mol/L H 2 O 2 with a reaction time of 45 min was regarded as the optimum conditions for the selective desoldering separation of electronic components (ECs) from the WPCBs. © 2017 American Institute of Chemical Engineers Environ Prog, 36: 873–878, 2017