Open AccessStable copper‐based 2D perovskite ( NH 3 C 3 H 6 NH 3 ) CuBr 4 thin film processed from green solvent for thermoelectric application
Author(s) -
Kang Zhenjing,
Xiong Hao,
Wu Bo,
Jiang Linqin,
Fan Baodian,
Yang Aijun,
Sa Baisheng,
Li Jiansheng,
Lin Lingyan,
Qiu Yu
Publication year - 2022
Publication title -
ecomat
Language(s) - English
Resource type - Journals
ISSN - 2567-3173
DOI - 10.1002/eom2.12163
Subject(s) - halide , seebeck coefficient , thin film , thermoelectric effect , perovskite (structure) , band gap , copper , spin coating , analytical chemistry (journal) , materials science , absorption (acoustics) , chemistry , inorganic chemistry , optoelectronics , crystallography , nanotechnology , composite material , thermal conductivity , physics , metallurgy , thermodynamics , chromatography
Great achievements about lead‐based halide perovskites have been made in the fields of photovoltaic solar cells, light emitting diodes, photodetectors, and thermoelectric devices. However, the toxicity and instability of lead‐based materials hinder their practical application. Herein, we used propane‐1,3‐diammonium cation to construct a copper‐based halide perovskite material (NH 3 C 3 H 6 NH 3 )CuBr 4 with a two‐dimensional layered structure. This material exhibits a suitable bandgap of 1.71 eV for a broad‐band absorption. Dense and flexible (NH 3 C 3 H 6 NH 3 )CuBr 4 thin film can be obtained by simple spin‐coating of the solution using green solvent DMSO. Furthermore, (NH 3 C 3 H 6 NH 3 )CuBr 4 shows excellent stability towards temperature, humidity and UV‐light. Finally, the (NH 3 C 3 H 6 NH 3 )CuBr 4 thin film shows a reasonable Seebeck coefficient of −13.8 μV K −1 and a power factor of 1.70 μW m −1 K −2 at 298 K, demonstrating the great potential for flexible n‐type thermoelectric application.