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Flip‐Chip Packaged Perovskite Solar Cells
Author(s) -
Huang Chun-Kai,
Chiu Chung-Yu,
Lai Tse-Lin,
Cheng Cheng,
Lai Wei-Han,
Chang Pai-Jung,
Wu Jin-Long,
Chiang Chien-Hung,
Wu Chun-Guey,
Liu Cheng-Yi
Publication year - 2021
Publication title -
energy technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.91
H-Index - 44
eISSN - 2194-4296
pISSN - 2194-4288
DOI - 10.1002/ente.202001129
Subject(s) - passivation , perovskite (structure) , materials science , energy conversion efficiency , perovskite solar cell , solar cell , optoelectronics , nitride , carrier lifetime , chemical engineering , layer (electronics) , nanotechnology , silicon , engineering
The oxide/nitride passivation and the flip‐chip package technology are developed for the perovskite solar cells. The heat resulting from the physical vapor deposition decomposes the active perovskite layer and degrades the efficiency of the perovskite solar cells down by more than 45%. Remarkably, with Si‐nitride passivation processed by plasma‐enhanced vapor deposition, the efficiency of the perovskite solar cell only decays about 9.1%. It is because that the plasma‐enhanced vapor deposition causes much less external energy on the perovskite solar cell. Using the exponential efficiency‐decay curves of the flip‐chip packaged perovskite solar cells, the characteristic time of the reliability‐tested solar cell can be calculated to be 145.8, 390.7, and 4864 h for air‐ambient, glove chamber, and water‐ambient tests, respectively. It is concluded that the concentration of O 2(g) in the reliability test ambient is the root cause for the efficiency degradation of the perovskite solar cells. The low mobility of O 2(g) under the water‐ambient reliability test results in the low probability of the adsorption of O 2(g) on the surface of the flip‐chip package, which is the key factor for the least efficiency degradation of the perovskite solar cells among the three reliability tests.