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Improving Heat Dissipation and Temperature Uniformity in Radiative Cooling Coating
Author(s) -
Zhang Hongkai,
Fan Desong
Publication year - 2020
Publication title -
energy technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.91
H-Index - 44
eISSN - 2194-4296
pISSN - 2194-4288
DOI - 10.1002/ente.201901362
Subject(s) - coating , materials science , radiative cooling , dissipation , thermal conduction , radiative transfer , heat transfer , composite number , thermal management of electronic devices and systems , miniaturization , composite material , thermal radiation , thermal insulation , thermodynamics , optics , nanotechnology , mechanical engineering , layer (electronics) , physics , engineering
Heat dissipation has become a key issue in electronic devices with high integration and miniaturization. As an effective way of heat transfer, radiative cooling has aroused a great attention in these devices. However, heat dissipation based on radiative cooling coating is limited by the poor heat spreading and temperature nonuniformity. Herein, a synergic augment strategy of excellent thermal conduction and strong thermal emission is proposed to improve the heat dissipation and temperature uniformity of radiative cooling coating. By the strategy, a composite coating consisting of poly(vinylidene fluoride‐co‐hexafluoropropene) and graphite is designed. It is shown via experiment that heat dissipation in composite coating is enhanced by 7% during daytime. A large temperature reduction of about 15.5 °C is obtained at the surface of the heat source with a composite coating during daytime. The temperature difference of the surface for composite coating within 2 °C demonstrates that the temperature uniformity of radiative cooling coating is improved.