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A Role of the Plating Regime in the Deposition of Bismuth Films onto a Carbon Paste Electrode. Microscopic Study
Author(s) -
Svancara Ivan,
Baldrianova Lucie,
Vlcek Milan,
Metelka Radovan,
Vytras Karel
Publication year - 2005
Publication title -
electroanalysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.574
H-Index - 128
eISSN - 1521-4109
pISSN - 1040-0397
DOI - 10.1002/elan.200403061
Subject(s) - bismuth , plating (geology) , deposition (geology) , scanning electron microscope , electrode , chemistry , layer (electronics) , electrolyte , carbon fibers , inorganic chemistry , carbon paste electrode , buffer solution , materials science , nuclear chemistry , analytical chemistry (journal) , metallurgy , electrochemistry , cyclic voltammetry , chromatography , composite material , composite number , organic chemistry , paleontology , sediment , geophysics , biology , geology
A microscopic study is presented based on observations of bismuth films deposited from various plating solutions and under different experimental conditions onto the carbon paste surface. Electrolytic plating of bismuth films was performed either as simulation of preconcentration in‐situ from a 0.2 M acetate buffer containing 5×10 −5 M Bi 3+ (pH 4.25), or as external deposition from various plating solutions: 0.1 M acetate buffer with 5×10 −4 M Bi 3+ (pH 4.50), 0.5 M HCl with either 0.001 M BiCl 3 or 0.005 M BiCl 3 , 0.5 M HCl+0.5 M KBr+0.005 M BiCl 3 , and 0.5 M HCl+0.5 M KI+0.005 M BiCl 3 (all pH≈0.5). Scanning electron microscopic images of the bismuth films showed a considerable variability in structure and compactness of the deposited layer in dependence on experimental conditions chosen such as the concentration of Bi(III) species, the total acidity of plating media, the stability of complexes of Bi(III) with halogenide anions or the deposition potential applied.