Premium
Effect of Cu Preferential Orientation on the Microstructure and Properties of Anodized Cu x O Films
Author(s) -
Gao Zhaoqing,
Cao Jinwei,
Wang Chen,
Chen Yinbo,
Muzammal Hussain Muhammad,
Wang Weiqiang,
Sun Hao,
Ma Haitao,
Wang Yunpeng
Publication year - 2020
Publication title -
european journal of inorganic chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.667
H-Index - 136
eISSN - 1099-0682
pISSN - 1434-1948
DOI - 10.1002/ejic.201901084
Subject(s) - anodizing , morphology (biology) , microstructure , chemistry , surface energy , orientation (vector space) , plane (geometry) , crystallography , chemical engineering , chemical physics , geometry , aluminium , genetics , biology , organic chemistry , mathematics , engineering
In this paper, in order to explore the effect of the preferential orientation of Cu on the preparation of robust anodized Cu 2 O films, three types of Cu substrates with three different preferential crystal plane orientation [(111), (200), (220)] are employed. First‐Principles calculation is employed to calculate the surface energy of different Cu crystalline planes by the software of DACAPO, which is conducted by the plane‐wave pseudo‐potential method. The influence of the preferential plane orientation of Cu on the anodized oxidation reaction process and the morphology of anodized Cu x O films has been discussed in detail. The results indicate that the morphology of anodized Cu x O films depends on the preferential exposing plane orientation of Cu substrates under the same anodized oxidation condition. The high surface energy of Cu makes Cu atoms release more easily from lattices, leading to more different active‐reaction sites.