A Novel 3D Cu I  Metal–Organic Framework with Middle‐Size Channels Despite the Sixfold ThSi 2  Interpenetrating Topological Structure | Zendy

Xie ChengZhi | Zendy; Zhang ZeFeng | Zendy; Zhang BaoFeng | Zendy; Wang XiaoQing | Zendy; Wang RuJi | Zendy; Shen GuangQiu | Zendy; Shen DeZhong | Zendy; Ding Bin | Zendy

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A Novel 3D Cu I Metal–Organic Framework with Middle‐Size Channels Despite the Sixfold ThSi 2 Interpenetrating Topological Structure

Author(s) -

Xie ChengZhi,

Zhang ZeFeng,

Zhang BaoFeng,

Wang XiaoQing,

Wang RuJi,

Shen GuangQiu,

Shen DeZhong,

Ding Bin

Publication year - 2006

Publication title -

european journal of inorganic chemistry

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.667

H-Index - 136

eISSN - 1099-0682

pISSN - 1434-1948

DOI - 10.1002/ejic.200500877

Subject(s) - chemistry , copper , topology (electrical circuits) , polymer , metal organic framework , metal , crystallography , organic chemistry , combinatorics , adsorption , mathematics

A new univalent copper coordination polymer with an unusual asymmetric ThSi 2 topological structural network was synthesized and 1D middle‐size channels were found despite the sixfold ThSi 2 interpenetrating topological structure. (© Wiley‐VCH Verlag GmbH & Co. KGaA, 69451 Weinheim, Germany, 2006)

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