Open AccessRecyclability and Self‐Healing of Dynamic Cross‐Linked Polyimide with Mechanical/Electrical Damage
Author(s) -
Wan Baoquan,
Zheng MingSheng,
Yang Xing,
Dong Xiaodi,
Li Yuchao,
Mai YiuWing,
Chen George,
Zha JunWei
Publication year - 2023
Publication title -
energy and environmental materials
Language(s) - English
Resource type - Journals
ISSN - 2575-0356
DOI - 10.1002/eem2.12427
Subject(s) - polyimide , materials science , composite material , glass transition , ultimate tensile strength , thermal stability , environmental pollution , covalent bond , polymer , self healing , self healing material , dynamic mechanical analysis , schiff base , modulus , polymer chemistry , organic chemistry , environmental science , chemistry , medicine , environmental protection , alternative medicine , layer (electronics) , pathology
Recyclability and self‐healing are two most critical factors in developing sustainable polymers to deal with environmental pollution and resource waste. In this work, a dynamic cross‐linked polyimide insulation film with full closed‐loop recyclability is successfully prepared, which also possesses good self‐healing ability after being mechanical/electrical damaged depending on the Schiff base dynamic covalent bonds. The recycled and self‐healed polyimide film still maintain its good tensile strength ( σ t ) >60 MPa with Young's modulus ( E ) >4 GPa, high thermal stability with glass transition temperature ( T g ) >220 °C, and outstanding insulation property with breakdown strength ( E 0 ) >358 kV mm −1 , making it a very promising low energy consumption and high temperature resistant insulation material. The strategy of using Schiff base dynamic covalent bonds for reversible repairing the structure of high T g polyimides promotes the wider application of such sustainable and recyclable material in the field of electrical power and micro‐electronics.