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Development of high thermal conductive epoxy composite for large current switchgear
Author(s) -
Komiya Gen,
Imai Takahiro,
Miyauchi Yasuhisa
Publication year - 2018
Publication title -
electrical engineering in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 28
eISSN - 1520-6416
pISSN - 0424-7760
DOI - 10.1002/eej.23155
Subject(s) - epoxy , switchgear , materials science , electrical conductor , composite number , composite material , thermal conductivity , thermal expansion , thermal , electrical engineering , engineering , physics , meteorology
Toshiba has developed solid insulated switchgear (SIS), which insulates the main circuit with epoxy composites. The solid insulating system is able not only to use no SF 6 , which is a kind of global warming gas, but also to supply compact equipment. In SIS, heat generated by the current loss in the conductors is dissipated through the epoxy composite. Therefore, development of high thermal conductive epoxy composites has been desired with respect to large current class SIS such as 2500 A. In this article, epoxy composite was filled with MgO having high thermal conductivity and SiO 2 having low thermal expansion coefficient. The result of temperature rise analysis of 40.5 kV–2500 A SIS demonstrated that the high thermal conductive epoxy composite reduced rising temperature by approximately 10 K compared to conventional epoxy composite.