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Crank‐shaped and Y‐shaped through‐hole interconnections filled with Au‐Sn solder
Author(s) -
Yamamoto Satoshi,
Nukaga Osamu,
Wakioka Hiroyuki,
Suemasu Tatsuo,
Hashimoto Hirokazu
Publication year - 2012
Publication title -
electrical engineering in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 28
eISSN - 1520-6416
pISSN - 0424-7760
DOI - 10.1002/eej.21134
Subject(s) - materials science , soldering , microelectromechanical systems , optoelectronics , wafer , crank , leakage (economics) , composite material , mechanical engineering , engineering , cylinder , economics , macroeconomics
Crank‐shaped and Y‐shaped through‐hole interconnections (THI) filled with Au‐Sn solder are demonstrated in this study. They are expected to realize a higher‐density wafer‐level package (WLP) for electrical devices including the fields of MEMS (Micro Electro‐Mechanical Systems) and MOEMS (Micro Optical Electro‐Mechanical Systems) compared with conventional WLP using THI consisting of straight through‐holes. In this paper, formation techniques for crank‐shaped and Y‐shaped THI are described. In order to make crank‐shaped and Y‐shaped through‐holes in a substrate, both femtosecond laser irradiation and wet chemical etching are used. Crank‐shaped through‐holes with an 80‐μm opening and 400 μm deep have also been achieved. Gold (Au)‐tin (Sn) solder was filled into the holes using the molten metal suction method (MMSM). Airtightness of the THI was examined using the helium leakage test, and the estimated leakage rate was less than 1.0 × 10 −9 Pa·m 3 /s, which is sufficient for use in WLP applications. © 2012 Wiley Periodicals, Inc. Electr Eng Jpn, 179(1): 54–62, 2012; Published online in Wiley Online Library ( wileyonlinelibrary.com) . DOI 10.1002/eej.21134