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Calculation of magnetic near field generated by the contact discharge of an ESD gun
Author(s) -
Fujiwara Osamu,
Mori Ikuko,
Ishigami Shinobu,
Yamanaka Yukio
Publication year - 2005
Publication title -
electrical engineering in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 28
eISSN - 1520-6416
pISSN - 0424-7760
DOI - 10.1002/eej.20194
Subject(s) - waveform , electrostatic discharge , oscilloscope , electrical engineering , voltage , magnetic field , equivalent circuit , current (fluid) , partial discharge , materials science , engineering , physics , quantum mechanics
An ESD (electrostatic discharge) testing is specified in the IEC 61000‐4‐2, in which the detailed waveform of the discharge current injected by an ESD gun is prescribed. However, due to lack of understanding of the discharge process, it is difficult to confirm whether or not the IEC current waveform can be injected onto actual equipment. We thus previously proposed an equivalent circuit model for the ESD gun based on its geometrical structure, and showed decisive factors for the discharge current. In this study, in order to confirm the feasibility of the above equivalent circuit model, we measured with a 6‐GHz wide‐band digital oscilloscope the discharge current through an SMA connector and the resultant magnetic near field for the contact discharge of an ESD gun. As a result, we found that both measured waveforms approximately agree with those calculated from our equivalent circuit model. We then measured with respect to charge voltages the magnetic near fields for the contact discharge of the ESD gun to the ground, which revealed that the measured waveform around the first peak is in fair agreement with the calculated one. Furthermore, we found that the magnetic field peak increases with increasing charge voltage, whose dependence can be predicted from our equivalent model. © 2005 Wiley Periodicals, Inc. Electr Eng Jpn, 153(1): 17–24, 2005; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20194