Problems of the application of N 2 /SF 6  mixtures to gas‐insulated bus | Zendy

Inami Kiyoshi | Zendy; Maeda Yasuhiro | Zendy; Habuchi Yoshitaka | Zendy; Yoshimura Manabu | Zendy; Hamano Suenobu | Zendy; Hama Hiroyuki | Zendy

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Problems of the application of N 2 /SF 6 mixtures to gas‐insulated bus

Author(s) -

Inami Kiyoshi,

Maeda Yasuhiro,

Habuchi Yoshitaka,

Yoshimura Manabu,

Hamano Suenobu,

Hama Hiroyuki

Publication year - 2001

Publication title -

electrical engineering in japan

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.136

H-Index - 28

eISSN - 1520-6416

pISSN - 0424-7760

DOI - 10.1002/eej.1100

Subject(s) - materials science , conductor , heat transfer , dielectric strength , dielectric , analytical chemistry (journal) , enclosure , impulse (physics) , sulfur hexafluoride , nuclear engineering , thermodynamics , electrical engineering , mechanics , composite material , chemistry , engineering , optoelectronics , physics , organic chemistry , chromatography , quantum mechanics

In designing a gas‐insulated bus (GIB) using N 2 /SF 6 mixtures, there are many application problems, such as the mixture pressure needed in order to maintain the required dielectric and heat transfer performance. Problems of recycling SF 6 are also essential in applying N 2 /SF 6 mixtures. This paper presents the minimum breakdown field strength at lightning impulse and the temperature rise of the conductor and enclosure as measured for N 2 /SF 6 mixtures. Considering the dielectric and heat transfer properties, we clarify the problems of application of mixtures to a GIB and discuss the appropriate mixture ratio of SF 6 in designing a GIB comparable to the present dimensions. In addition, the lowest limit of SF 6 content in a liquefied recovering method is theoretically estimated for reference in practical SF 6 recovery from mixtures. It is important for design to consider both breakdown phenomena, including the area effect of electrode, and the heat transfer properties of mixtures. © 2001 Scripta Technica, Electr Eng Jpn, 137(4): 25–31, 2001

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