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Electric field optimization of the power cable joint by using evolutionary calculation method
Author(s) -
Yonetsu Daigo,
Hara Takehisa,
Shimada Shigeki,
Kaji Mikio
Publication year - 2005
Publication title -
electrical engineering in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 28
eISSN - 1520-6416
pISSN - 0424-7760
DOI - 10.1002/eej.10287
Subject(s) - electric field , field (mathematics) , genetic algorithm , joint (building) , field strength , constraint (computer aided design) , computer science , power (physics) , algorithm , engineering , mathematical optimization , physics , mechanical engineering , mathematics , structural engineering , magnetic field , quantum mechanics , pure mathematics
This paper examines electric field optimizations at the joint of power cables by using evolution strategy [(1+1)‐ES, (µ+λ)‐ES] and genetic algorithm which are so‐ called evolutionary calculation methods. The object of the paper is to minimize the electric field strength on the inner curved electrode under the constraint that the electric field strength along the interface between the two different insulators should be below the permissible value. The surface charge method that provides accurate solutions on the boundaries for the multilayer substances with a relatively small number of elements is employed for the calculation of the electric field distribution. Three evolutionary calculation methods are employed for the optimization method. Because these methods employ mutation and rearrangement (cross‐over) processes, the shape design can be performed widely and locally. As a result, each method can reduce the electric field strength on the inner curved electrode while the electric field strength along the interface was kept below the permissible value. The search results of each optimization method were compared and (µ+λ)‐ES was found to have the best performance of the three methods. © 2005 Wiley Periodicals, Inc. Electr Eng Jpn, 150(4): 44–53, 2005; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.10287