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A study of the occurrence mechanism for undershoot of logic signal
Author(s) -
Toyoda Keiji
Publication year - 2003
Publication title -
electrical engineering in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 28
eISSN - 1520-6416
pISSN - 0424-7760
DOI - 10.1002/eej.10141
Subject(s) - overshoot (microwave communication) , time domain , transient (computer programming) , waveform , signal (programming language) , control theory (sociology) , distortion (music) , electronic circuit , frequency domain , electronic engineering , cmos , physics , engineering , electrical engineering , computer science , voltage , amplifier , control (management) , artificial intelligence , computer vision , programming language , operating system
Waveform distortion of logic signal caused by accelerated clock speed and increased implementation density causes nonlinear output and has been responsible for behavioral problems in electronic systems, including the overshoot type, hysteresis type, and undershoot type of transient waveform distortion. Deep undershoot could cause latchup of CMOS logic ICs, data destruction in DRAM, and pulse splitting in TTL ICs. Undershoot of logic signals is discussed in terms of both transient phenomena (time domain) and filter theory (frequency domain). Variation of the resistance R caused by output circuit impedance variation creates time domain variations in such quantities as the damping constant α and damping coefficient ζ, while variation of resistance R creates Q variation in the frequency domain. This paper describes a mechanism by which undershoot occurs when parasitic series resonance circuits are formed on the load side of the driving device and the damping coefficient ζ varies time‐sequentially in totem‐pole or complementary circuits. PSpice simulation suggests that undershoot can be reduced by controlling the phase of the punchthrough current. © 2002 Wiley Periodicals, Inc. Electr Eng Jpn, 142(3): 41–48, 2003; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.10141