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Development of dry‐nano‐polishing technique using reactive ion etching for ultra thin titanium wafer
Author(s) -
Chino Teruya,
Watanabe Yuta,
Tsukiyama Yosuke,
Sohgawa Masayuki,
Abe Takashi
Publication year - 2021
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.12317
Subject(s) - reactive ion etching , wafer , photoresist , materials science , dry etching , titanium , etching (microfabrication) , polishing , photolithography , nano , thin film , metallurgy , composite material , optoelectronics , nanotechnology , layer (electronics)
In this study, we developed a dry‐nano‐polishing technique using reactive ion etching for ultra thin titanium wafer. The surface of titanium coated with photoresist is polished by reactive ion etching using SF6 /C4F8 gas. Etching speed of titanium and photoresist were adjusted to close to each other by changing temperature and ratio of SF6 /C4F8 gas. By etching titanium under these conditions, the smooth surface shape of the resist was transferred to titanium. By combining with photolithography, it is possible to polish a specific part.