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Silicon migration seal wafer‐level vacuum encapsulation
Author(s) -
Suzuki Yukio,
Dupuit Victor,
Kojima Toshiya,
Kanamori Yoshiaki,
Tanaka Shuji
Publication year - 2021
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.12283
Subject(s) - wafer , materials science , microelectromechanical systems , silicon , seal (emblem) , optoelectronics , encapsulation (networking) , composite material , wafer level packaging , computer science , art , visual arts , computer network
Silicon migration seal (SMS) wafer‐level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4‐inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.