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Super broadband acoustic impedance matching by MUT‐type acoustic metamaterial
Author(s) -
Tanaka Hiroki,
Machida Shuntaro
Publication year - 2020
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.12228
Subject(s) - impedance matching , acoustics , matching (statistics) , acoustic impedance , broadband , bandwidth (computing) , finite element method , acoustic wave , metamaterial , ultrasonic sensor , computer science , electrical impedance , materials science , physics , engineering , mathematics , telecommunications , optoelectronics , electrical engineering , structural engineering , statistics
We show the structure and matching theory of MUT‐type acoustic matching device. A simulation model of the finite element method was constructed and the following evaluations were made: (1) analysis of the stress distribution inside the proposed device in order to find the mechanism of ultrasound propagation, (2) comparison of the performance as an acoustic matching device with the conventional matching layer method in ultrasound frequency, and (3) dependence of acoustic matching performance on design parameters. The MUT‐type acoustic matching device based on the proposed design guidance showed higher acoustic transmittance and wider bandwidth than the conventional 1/4 wavelength acoustic matching system.