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Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules–Metal Composite Interface
Author(s) -
FURUNO RYOTA,
TAKATUJI YOSHIYUKI,
KUBO KIMIHIKO,
HARUYAMA TETSUYA
Publication year - 2017
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.11924
Subject(s) - epoxy , thermosetting polymer , materials science , adhesive , composite material , adhesion , delamination (geology) , composite number , metal , polymer , layer (electronics) , metallurgy , paleontology , biology , subduction , tectonics
SUMMARY Delamination in semiconductor plastic package is a cause of reliability degradation. We have tried to improve the adhesion strength between leadframe and epoxy resin. In this study, organic molecules–metal (Cu) complex “EC tag (Cu)” were employed. It is immobilized on the leadframe surface as adhesion promoter to adhere with thermosetting epoxy resin. In the results, immobilized EC tag (Cu) act as adhesion promoter that shows greater adhesion between leadframe and epoxy resin. Also, the leadframe with adhesion promoter doesn't affect semiconductor assembly characteristics.