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Review of Low‐Temperature Bonding Technologies and Their Application in Optoelectronic Devices
Author(s) -
HIGURASHI EIJI,
SUGA TADATOMO
Publication year - 2016
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.11805
Subject(s) - microelectronics , microelectromechanical systems , materials science , fabrication , optoelectronics , direct bonding , photonics , wire bonding , engineering physics , nanotechnology , computer science , silicon , engineering , telecommunications , chip , medicine , alternative medicine , pathology
SUMMARY Low‐temperature bonding is an important fabrication technique for advanced microelectronics, microelectromechanical systems (MEMS), and optoelectronic devices. Recently, many low‐temperature bonding techniques such as surface activated bonding have been studied in order to create unique device structures for a wide range of photonics applications. This paper focuses on low‐temperature bonding techniques and reviews the state‐of‐the‐art applications involving optoelectronic devices.