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Development of polyamide‐imide/silica nanocomposite enameled wire
Author(s) -
Kikuchi Hideyuki,
Hanawa Hidehito,
Honda Yuki
Publication year - 2013
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.11456
Subject(s) - polyamide , nanocomposite , imide , materials science , composite material , polymer chemistry
Nanocomposite materials based on polyamide‐imide have not been able to prevent nano‐particles from aggregating, and therefore the development of this material has been extremely dicult. However, we prevented aggregation of nano‐particles by developing the low‐hygroscopicity solvent and the copolyamide‐imide, and commercialized a new partial discharge‐resistant enameled wire with nanocomposite polyamide‐imide insulating material in 2010. The lifetime of the newly developed partial discharge‐resistant nanocomposite polyamide‐imide enameled wire is 1000 or more times that of ordinary organic‐enameled wire. The lifetime of the new wire is also excellent in a high‐temperature atmosphere. © 2013 Wiley Periodicals, Inc. Electron Comm Jpn, 96(6): 41–48, 2013; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11456