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Three‐axis MEMS combined sensor for electronic stability control system
Author(s) -
Jeong Heewon,
Goto Yasushi,
Aono Takanori,
Nakamura Toshiaki,
Hayashi Masahide
Publication year - 2012
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.11376
Subject(s) - microelectromechanical systems , gyroscope , acceleration , automotive engineering , wafer , rotation (mathematics) , automotive industry , electronic stability control , vibrating structure gyroscope , range (aeronautics) , vibration , control system , computer science , automotive electronics , electrical engineering , engineering , mechanical engineering , materials science , acoustics , optoelectronics , physics , aerospace engineering , classical mechanics , artificial intelligence
We developed a microelectromechanical systems (MEMS) combined sensor that can measure two‐axis accelerations and angular rate (rotation) for use in electronic stability control systems for automobiles. The recent trend of mounting combined sensors in the engine compartment of vehicles has led to a dramatic increase in the operation temperature range as well as demands for immunity to environmental disturbances such as vibration. In this paper, we propose a combined sensor that has one gyroscopic part and two acceleration parts placed on a single die. We used a deformation‐robust MEMS structure to ensure stable operation over a wide temperature range (–40 to 125 °C) in the engine compartment. A package as small as 10 × 19 × 4 mm was achieved by using through silicon via and wafer‐level package technologies. The performance of the sensor was sufficient to meet current automotive standards. © 2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(7): 49–57, 2012; Published online in Wiley Online Library ( wileyonlinelibrary.com ). DOI 10.1002/ecj.11376