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Numerical simulation of thermal interaction between polymer and argon induction thermal plasma
Author(s) -
Takeuchi Yoshitaka,
Tanaka Yasunori,
Uesugi Yoshihiko,
Kaneko Shuhei,
Okabe Shigemitsu
Publication year - 2009
Publication title -
electronics and communications in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.131
H-Index - 13
eISSN - 1942-9541
pISSN - 1942-9533
DOI - 10.1002/ecj.10226
Subject(s) - quenching (fluorescence) , plasma , polymer , evaporation , materials science , thermal , thermodynamics , argon , boiling , chemistry , composite material , organic chemistry , optics , physics , quantum mechanics , fluorescence
Influence of polymer powder injection into Ar thermal plasmas was investigated by numerical approaches. Thermal plasma–polymer solid coupling phenomena such as melting and evaporation were considered to study plasma‐quenching effect of polymer injection. Dominant process for decay of plasma temperature was examined by changing thermodynamic parameters such as melting, boiling temperatures and their latent heats of solid and liquid polymers. As a result, thermodynamic properties of evaporated polymer vapor directly affect plasma‐quenching phenomena more markedly than the properties of liquid and solid which influence plasma quenching efficiency through the amount of evaporation. © 2009 Wiley Periodicals, Inc. Electron Comm Jpn, 92(1): 24–33, 2009; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/ecj.10226