z-logo
open-access-imgOpen Access
Palladium thin films grown by CVD from (1,1,1,5,5,5‐hexafluoro‐2,4‐pentanedionato) palladium( II )
Author(s) -
Bhaskaran Vijay,
HampdenSmith Mark J.,
Kodas Toivo T.
Publication year - 1997
Publication title -
chemical vapor deposition
Language(s) - English
Resource type - Journals
eISSN - 1521-3862
pISSN - 0948-1907
DOI - 10.1002/cvde.19970030506
Subject(s) - palladium , auger electron spectroscopy , substrate (aquarium) , deposition (geology) , analytical chemistry (journal) , crystallite , chemistry , thin film , materials science , catalysis , nanotechnology , crystallography , organic chemistry , paleontology , physics , oceanography , sediment , nuclear physics , biology , geology
The precursor (1,1,1,5,5,5‐hexafluoro‐2,4‐pentanedionato) palladium( II ) [Pd(hfac) 2 ] was used to deposit high‐purity, polycrystalline palladium films under low‐pressure CVD conditions at high growth rates (1000–4000 Å/min) over a substrate temperature range of 80–200°C in the presence of H 2 . Mixing of the precursor and H 2 streams near the substrate was required to avoid reactions of the precursor with H 2 at locations other than the substrate surface. Auger electron spectroscopy (AES) showed that the films were impurity free when sufficient H 2 was used. Resistivity values of 20 μΩ were obtained at the higher deposition temperatures (∼200 °C) while high values of 50 μω were observed at the lower deposition temperatures (∼90 °C). The deposition rate was feed‐rate limited even at the lowest deposition temperatures and highest precursor delivery rates, suggesting that even higher deposition rates could be obtained with higher feed rates. A high precursor conversion of 50–60 % was observed. The high surface reaction probability of Pd(hfac) 2 in the presence of H 2 was reflected qualitatively by trench fill studies which showed a greater film thickness on the top of sub‐micrometer trenches than in the bottom.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here