Premium
Thin‐film deposition by combining plasma jet with spark discharge source at atmospheric pressure
Author(s) -
Ussenov Yerbolat A.,
Toktamyssova Moldir T.,
Dosbolayev Merlan K.,
Gabdullin Maratbek T.,
Daniyarov Talgat T.,
Ramazanov Tlekkabul S.
Publication year - 2021
Publication title -
contributions to plasma physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.531
H-Index - 47
eISSN - 1521-3986
pISSN - 0863-1042
DOI - 10.1002/ctpp.202000140
Subject(s) - materials science , scanning electron microscope , evaporation , substrate (aquarium) , thin film , plasma , analytical chemistry (journal) , raman spectroscopy , copper , atmospheric pressure , atmospheric pressure plasma , electrode , dielectric barrier discharge , deposition (geology) , composite material , optics , optoelectronics , nanotechnology , dielectric , metallurgy , chemistry , paleontology , quantum mechanics , physics , sediment , geology , oceanography , biology , chromatography , thermodynamics
This study demonstrates a method for the deposition of CuO x thin films by combining atmospheric pressure plasma jet with spark discharge. In this type of discharge source, the bulk copper material of spark discharge electrodes plays the role of a precursor. Copper atoms and particles go through the physical processes of sputtering, evaporation, and further agglomeration and condensation in the plasma jet and on the substrate. The experiments were carried out with and without a combination of discharges. The material coated on the substrate was studied using a scanning electron microscope, Raman spectroscopy, and energy‐dispersive X‐ray spectroscopy. The characteristics of the set‐up and plasma, such as I‐V curves, optical emission spectra, and substrate temperature, were also measured. Copper electrodes were examined for erosion by a scanning electron microscope. The results demonstrate that deposits coated by combined discharge show denser and thicker films.