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Cover Picture: Contrib. Plasma Phys. 9/2012
Publication year - 2012
Publication title -
contributions to plasma physics
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 0.531
H-Index - 47
eISSN - 1521-3986
pISSN - 0863-1042
DOI - 10.1002/ctpp.201290014
Subject(s) - duty cycle , cover (algebra) , plasma , materials science , recipe , etching (microfabrication) , micrograph , mechanics , nanotechnology , physics , thermodynamics , composite material , chemistry , scanning electron microscope , mechanical engineering , nuclear physics , layer (electronics) , engineering , power (physics) , food science
Abstract SEM micrograph of a preliminary result of Si etching profile obtained for alternatively intermittent flow recipe at condition of 60% SF 6 /40% CH 4 duty cycle (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)