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A rail‐to‐rail ultra‐wide bandwidth hybrid supply modulator for 5G applications with envelope tracking techniques
Author(s) -
Chen JiannJong,
Hwang YuhShyan,
Liao YingJie,
Ku Yitsen,
Yu ChengChieh
Publication year - 2019
Publication title -
international journal of circuit theory and applications
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.364
H-Index - 52
eISSN - 1097-007X
pISSN - 0098-9886
DOI - 10.1002/cta.2698
Subject(s) - bandwidth (computing) , electronic engineering , cmos , chip , amplifier , sine wave , electrical engineering , computer science , voltage , engineering , telecommunications
Summary A rail‐to‐rail ultra‐wide bandwidth hybrid supply modulator for 5G applications is presented in this paper. The proposed supply modulator has 600‐MHz bandwidth, which is the widest available bandwidth today. The hybrid supply modulator uses envelope tracking (ET) technique to achieve optimal efficiency. This circuit achieves high efficiency with wide bandwidth by combining the linear amplifier (LA) and the switching converter. The optimal size of the LA output stage provides a good tracking ability. The proposed hysteresis window circuit uses the simplified number of MOSFET that reduces the chip area and increases the efficiency of the overall system. This chip has been fabricated in TSMC 90‐nm CMOS processes, and the maximum tracking ability can reach to 600‐MHz sine wave. The output voltage range of the sine wave is from 0.19 to 0.79 V. The maximum load current is 122 mA. The proposed supply modulator is suitable for 5G applications. The chip area is 0.87 mm × 0.87 mm.