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Optimal transistor sizing for maximum yield in variation‐aware standard cell design
Author(s) -
Abbas Zia,
Olivieri Mauro
Publication year - 2016
Publication title -
international journal of circuit theory and applications
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.364
H-Index - 52
eISSN - 1097-007X
pISSN - 0098-9886
DOI - 10.1002/cta.2167
Subject(s) - sizing , spice , process variation , cmos , transistor , electronic engineering , voltage , integrated circuit , standard cell , monte carlo method , yield (engineering) , integrated circuit design , electronic circuit , power (physics) , computer science , engineering , electrical engineering , mathematics , materials science , statistics , physics , art , quantum mechanics , metallurgy , visual arts
Summary Process variability, in addition to wide temperature and supply voltage variation ranges, severely degrades the fabrication outcome (yield) of digital cells as for the fulfillment of performance specification bounds. This paper presents the application of mathematical optimization to the design of standard cells that are robust to process variations even in worst‐case operating conditions. The method attains the optimal sizing of individual transistors in the cell for maximizing the statistical yield referring to leakage power and propagation delay bounds, with local and global process variations specified by industrial process development kits (PDKs). The approach is demonstrated for a 40 nm low‐power standard threshold voltage Complementary Metal Oxide Semiconductor (CMOS) technology, for an intended operating temperature range [−40 °C, 125 °C] and supply voltage range [0.95 V, 1.05 V]. The reported optimization results show a yield improvement from an initial 50% to 99.9%, and Simulation Program with Integrated Circuit Emphasis (SPICE)‐level Monte Carlo analysis confirmed the estimated yield of the obtained circuits. Copyright © 2015 John Wiley & Sons, Ltd.