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Mechanical Properties of Copper Films
Author(s) -
Chourasia N. C.,
Kalkundri S. B.,
Gadgeel V. L.
Publication year - 1993
Publication title -
crystal research and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.377
H-Index - 64
eISSN - 1521-4079
pISSN - 0232-1300
DOI - 10.1002/crat.2170280422
Subject(s) - copper , materials science , adhesion , ultimate tensile strength , substrate (aquarium) , composite material , metallurgy , oceanography , geology
Mechanical properties of vacuum‐deposited copper films have been studied on various well cleaned and polished substrates. The density reaches the bulk value for a film thickness of 4 μm and above. The strain developed during the growth of film was found to be tensile and is dependent on nature of the substrate. The adhesion of film was observed to be thickness — and time of ageing dependent. The results are discussed.