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To the non‐dislocation model of crystal tensile strength
Author(s) -
Vlasov A. D.
Publication year - 1990
Publication title -
crystal research and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.377
H-Index - 64
eISSN - 1521-4079
pISSN - 0232-1300
DOI - 10.1002/crat.2170251118
Subject(s) - ultimate tensile strength , dislocation , materials science , crystal (programming language) , modulus , thermal , stress (linguistics) , composite material , condensed matter physics , crystallography , thermodynamics , physics , chemistry , linguistics , philosophy , computer science , programming language
The non‐dislocation model of crystal planes slipage has been proposed. The slipage of two planes begins when these planes have diverged to the critical distance by influence of the thermal stress σ th that had to be appeared owing to heating of these planes above bulk temperature. This heating is due to the phenomenon supposed by the author, called the effective temperature of crystal surfaces. In such a way the simple expression for load/microscopic strain relation has been proposed. The calculated ratio: tensile strength/Young's modulus (6 · 10 −3 ) is in good agreement with experimental data (of 1 to 2 · 10 −3 ) for a number of metals. The common theories on tensile strength do not take into account the above mentioned thermal stress and this is the reason for theoretical data on strength being of three orders of magnitude above the experimental values.