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Interfacial stability and grain diameter of the metal phase of directionally solidified Al‐Si‐type eutectics
Author(s) -
Vetter Jörg,
Schmidt Günther,
Frühauf Joachim
Publication year - 1985
Publication title -
crystal research and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.377
H-Index - 64
eISSN - 1521-4079
pISSN - 0232-1300
DOI - 10.1002/crat.2170200924
Subject(s) - eutectic system , supercooling , materials science , phase (matter) , metal , grain size , crystallography , morphology (biology) , planar , analytical chemistry (journal) , metallurgy , microstructure , thermodynamics , chemistry , chromatography , physics , genetics , organic chemistry , computer graphics (images) , biology , computer science
The morphology of the solid‐liquid interface and the metal phase grain diameter of Al—Si‐type eutectics (Al—Si, Ag—Si, Ag—Ge, Zn—Ge) were investigated in the range of a growth rate R = 0.2 … 20 mm/h and of a temperature gradient at the solid‐liquid interface G = 2 … 25 K/mm. Three types of interfacial morphologies depending on the G / R ratios were found out. The G / R ratio of the transition from a planar to a nonplanar solid‐liquid interface corresponds to the critical G / R | c ratio, which can be calculated by the criterion of the constitutional undercooling. The grain diameter of the metal phase depends on growth parameters as follows: d K ∼ R —r G —g with r = 0.33 … 0.43 and g = −0.37 … 0.03.