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Crack temperature rise due to crack propagation in visco‐plastic materials
Author(s) -
Michel B.,
Gründemann H.
Publication year - 1983
Publication title -
crystal research and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.377
H-Index - 64
eISSN - 1521-4079
pISSN - 0232-1300
DOI - 10.1002/crat.2170180506
Subject(s) - materials science , thermal conduction , dissipation , mechanics , viscoelasticity , work (physics) , convection , hardening (computing) , fracture mechanics , finite element method , plasticity , field (mathematics) , strain hardening exponent , crack closure , composite material , thermodynamics , physics , mathematics , layer (electronics) , pure mathematics
An attempt is made to simulate the temperature field connected with a propagating crack in a visco‐plastic material. The authors apply modern continuum thermodynamics of strain‐rate sensitive work‐hardening materials to describe heat dissipation, convection, and conduction phenomena connected with the temperature development in the near‐crack region. The powerful finite element technique has been used to solve the coupled thermomechanical system of field equations being highly non‐linear. The results are in a better agreement with experiments than those obtained by the classic uncoupled methods.