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Control of the phase composition and morphology of a Cu‐Sb eutectic alloy via liquid‐liquid structure transition
Author(s) -
Huang ZhongYue,
Zu FangQiu,
Li XiaoYun
Publication year - 2012
Publication title -
crystal research and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.377
H-Index - 64
eISSN - 1521-4079
pISSN - 0232-1300
DOI - 10.1002/crat.201200116
Subject(s) - eutectic system , supercooling , materials science , alloy , eutectic bonding , phase (matter) , metallurgy , phase transition , electrical resistivity and conductivity , morphology (biology) , thermodynamics , chemical engineering , chemistry , physics , genetics , organic chemistry , biology , electrical engineering , engineering
The current paper focuses on the solidification characteristics of a Cu‐Sb eutectic alloy in its different liquid states. Liquid alloy resistivity‐temperature patterns suggest an irreversible temperature‐induced liquid‐liquid structure transition (TI‐LLST), and a reversible TI‐LLST occurred during the heating‐cooling runs. A set of solidification experiments was conducted based on the results. The irreversible TI‐LLST caused an enhanced solidification undercooling, increased solidification rate, refined regular eutectic morphologies, and absence of a pre‐eutectic Cu 2 Sb phase. The reversible TI‐LLST resulted in different phase compositions and eutectic structures. The mechanisms behind these transitions are also briefly discussed.