Premium
The application of scanning microscopy in the study of brittleness in copper and its alloys
Author(s) -
Joszt Kazimierz,
Ciura Ludwik
Publication year - 1977
Publication title -
kristall und technik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.377
H-Index - 64
eISSN - 1521-4079
pISSN - 0023-4753
DOI - 10.1002/crat.19770120409
Subject(s) - materials science , brittleness , fracture (geology) , grain boundary , copper , dimple , metallurgy , brittle fracture , deformation (meteorology) , composite material , microstructure
Among others the following results were attained: the transcrystalline ductile fracture of copper and some of its alloys resulting from a considerable plastic deformation, with numerous dimples, in the middle of which there usually appear second phase inclusions. — Intercrystalline fracture due to cracks along the grain boundaries may be different, sometimes scarecely to be disguished from the transcrystalline cleavable fracture. It should rank among brittle fracture as its appearance is always characterized by considerable brittleness of the material. Brittleness of copper and its alloys result from precipitations of these phases on the grain boundaries.