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Fabrication of Metal‐Nanoparticle‐Modified Semiconducting Copper– and Silver–TCNQ Materials as Substrates for the Reduction of Chromium(VI) Using Thiosulfate Ions at Ambient Temperature
Author(s) -
Pearson Andrew,
O'Mullane Anthony P.
Publication year - 2013
Publication title -
chempluschem
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.801
H-Index - 61
ISSN - 2192-6506
DOI - 10.1002/cplu.201300293
Subject(s) - thiosulfate , materials science , nanoparticle , galvanic cell , inorganic chemistry , copper , formic acid , catalysis , aqueous solution , metal , chemical engineering , noble metal , nanotechnology , chemistry , organic chemistry , metallurgy , sulfur , engineering
The formation of readily recoverable and reusable organic semiconducting Cu‐ and AgTCNQ (TCNQ=7,7,8,8‐tetracyanoquinodimethane) microstructures decorated with Pt and Pd metallic nanoparticles is described for the effective reduction of Cr VI ions in aqueous solution at room temperature using both formic acid and an environmentally friendly thiosulfate reductant. The M‐TCNQ (M=metal) materials were formed by electrocrystallisation onto a glassy carbon surface followed by galvanic replacement in the presence of H 2 PtCl 6 or PdCl 2 to form the composite material. It was found that loading of the surface with nanoparticles could easily be controlled by changing the metal salt concentration. Significantly, the M‐TCNQ substrates facilitated the formation of well‐isolated metal nanoparticles on their surfaces under appropriate galvanic replacement conditions. The semiconductor–metal nanoparticle combination was also found to be critical to the catalyst performance, wherein the best‐performing material was CuTCNQ modified by well‐isolated Pt nanoparticles with both formic acid and thiosulfate ions as the reductant.