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Adhesion on the Nano‐ and Macroscale: Interaction between Copper and SAN/SMAh Copolymers
Author(s) -
Božović Vukić Jelena,
Hoeppener Stephanie,
Kozodaev Dmitry A.,
Kisin Srdjan,
Klumperman Bert,
Schubert Ulrich S.,
de With Gijsbertus,
Koning Cor E.
Publication year - 2006
Publication title -
chemphyschem
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.016
H-Index - 140
eISSN - 1439-7641
pISSN - 1439-4235
DOI - 10.1002/cphc.200600318
Subject(s) - copolymer , adhesion , materials science , maleic anhydride , polymer chemistry , styrene , force spectroscopy , acrylonitrile , copper , polymer science , polymer , nanotechnology , chemical engineering , atomic force microscopy , composite material , engineering , metallurgy
Adhesion‐promoting linkers : Block copolymers hold promise for their application in improving the properties of substrates. Copper‐coated scanning force microscopy tips (see figure) can be used to investigate the adhesion differences of two model copolymers: poly(styrene ‐co‐ acrylonitrile) and poly(styrene ‐alt‐ maleic anhydride) (SAN and SMAh). Adhesion properties are analyzed by force spectroscopy and macroscopic pull‐off tests.