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A New Approach on the Active Treatment for Electroless Copper Plating on Glass
Author(s) -
ZhengChun Liu,
QuanGuo He,
JianXin Tang,
PengFeng Xiao,
gYue He,
ZuHong Lu
Publication year - 2003
Publication title -
chinese journal of chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.28
H-Index - 41
eISSN - 1614-7065
pISSN - 1001-604X
DOI - 10.1002/cjoc.20030210102
Subject(s) - chemistry , copper , monolayer , copper plating , formaldehyde , deposition (geology) , catalysis , electroless plating , metal , electroless deposition , plating (geology) , reducing agent , inorganic chemistry , metallurgy , layer (electronics) , organic chemistry , electroplating , materials science , paleontology , biochemistry , sediment , geophysics , biology , geology
A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with μ‐amimopropyltrimethoxysilane to form self‐assembled monolayer (SAM) on it. Then it was dipped directly into PdCl 2 solution instead of the conventional SnCl 2 sensitization followed by PdCl 2 activation. Experimental results showed that the Pd 2+ ions from PdCl 2 solution were coordinated to the ammo groups on the glass surface resulting in the formation of N—Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N—Pd complexes were reduced to Pd 0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM‐modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.