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The Electrolytic “Sintering” of Nickel Powder
Author(s) -
Henderson I. H. S.,
Ladan S. G.
Publication year - 1968
Publication title -
the canadian journal of chemical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.404
H-Index - 67
eISSN - 1939-019X
pISSN - 0008-4034
DOI - 10.1002/cjce.5450460514
Subject(s) - nickel , plating (geology) , chloride , nitrate , sintering , electrolyte , suspension (topology) , deposition (geology) , cathodic protection , metallurgy , materials science , inorganic chemistry , nuclear chemistry , chemistry , anode , electrode , organic chemistry , sediment , paleontology , mathematics , homotopy , geophysics , pure mathematics , biology , geology
Adherent and coherent deposits of nickel sponge similar to sintered nickel may be made from sulphate, chloride, fluoborate or sulphamate nickel plating solutions containing nickel powder in suspension, providing the concentration of free acid is maintained sufficiently high to inhibit co‐depesition of Ni(OH) 2 *In nitrate solution, cathodic reduction of nitrate and deposition of Ni(OH) 2 predominates.