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Characteristics of End‐of‐Life Printed Wiring Boards Processed by Electrodynamic Fragmentation
Author(s) -
Martino Rémi,
Iseli Cédric,
Gaydardzhiev Stoyan,
StreicherPorte Martin,
Weh Alexander
Publication year - 2017
Publication title -
chemie ingenieur technik
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.365
H-Index - 36
eISSN - 1522-2640
pISSN - 0009-286X
DOI - 10.1002/cite.201600091
Subject(s) - breakage , fragmentation (computing) , grinding , printed circuit board , materials science , 3d printed , hammer , mechanical engineering , composite material , engineering , process engineering , automotive engineering , engineering drawing , electrical engineering , computer science , manufacturing engineering , operating system
Electrodynamic fragmentation (EDF) is an innovative technique which enables selective fragmentation of material. Its inherent selective breakage principles enable liberation while avoiding fine grinding. In this study, the specific effects of the EDF on end‐of‐life printed wiring boards have been assessed. A novel methodology for their EDF processing has been developed and compared with hammer mill shredding. Various energy inputs and treatment stages have resulted in fragmentation degrees ranging from removal of components to structure delamination and subsequent size reduction.