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DNA‐Mediated Self‐Assembly and Metallization of Semiconductor Nanorods for the Fabrication of Nanoelectronic Interfaces
Author(s) -
Weichelt Richard,
Ye Jingjing,
Banin Uri,
Eychmüller Alexander,
Seidel Ralf
Publication year - 2019
Publication title -
chemistry – a european journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.687
H-Index - 242
eISSN - 1521-3765
pISSN - 0947-6539
DOI - 10.1002/chem.201902148
Subject(s) - nanorod , nanotechnology , materials science , semiconductor , fabrication , nanomaterials , nanostructure , self assembly , heterojunction , optoelectronics , medicine , alternative medicine , pathology
DNA nanostructures provide a powerful platform for the programmable assembly of nanomaterials. Here, this approach is extended to semiconductor nanorods that possess interesting electrical properties and could be utilized for the bottom‐up fabrication of nanoelectronic building blocks. The assembly scheme is based on an efficient DNA functionalization of the nanorods. A complete coverage of the rod surface with DNA ensures a high colloidal stability while maintaining the rod size and shape. It furthermore supports the assembly of the nanorods at defined docking positions of a DNA origami platform with binding efficiencies of up to 90 % as well as the formation of nanorod dimers with defined relative orientations. By incorporating orthogonal binding sites for gold nanoparticles, defined metal‐semiconductor heterostructures can be fabricated. Subsequent application of a seeded growth procedure onto the gold nanoparticles (AuNPs) allows for to establish a direct metal‐semiconductor interface as a crucial basis for the integration of semiconductors in self‐assembled nanoelectronic devices.