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Spatially‐Resolved Multiple Metallopolymer Surfaces by Photolithography
Author(s) -
Müller Rouven,
Feuerstein Thomas J.,
Trouillet Vanessa,
Bestgen Sebastian,
Roesky Peter W.,
BarnerKowollik Christopher
Publication year - 2018
Publication title -
chemistry – a european journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.687
H-Index - 242
eISSN - 1521-3765
pISSN - 0947-6539
DOI - 10.1002/chem.201803966
Subject(s) - tetrazole , x ray photoelectron spectroscopy , materials science , platinum , polymerization , cycloaddition , polymer chemistry , metal , nanotechnology , chemistry , polymer , chemical engineering , photochemistry , organic chemistry , catalysis , engineering
A tetrazole‐based photoligation protocol for the spatially‐resolved encoding of various defined metallopolymers onto solid surfaces is introduced. By using this approach, fabrication of bi‐ and trifunctional metallopolymer surfaces with different metal combinations were achieved. Specifically, α‐ω‐functional copolymers containing bipyridine as well as triphenylphosphine ligands were synthesized through reversible addition‐fragmentation chain transfer (RAFT) polymerization, and subsequently metal loaded to afford metallopolymers of the widely‐used metals gold, palladium, and platinum. Spatially‐resolved surface attachment was achieved by means of a nitrile imine‐mediated tetrazole‐ene cycloaddition (NITEC) based photoligation protocol, exploiting tethered tetrazoles and metallopolymers equipped with a maleimide chain terminus. Metallopolymer coated surfaces with three different metals were prepared and characterized by time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS) and spatially‐resolved X‐ray photoelectron spectroscopy (XPS) mapping, supporting the preserved chemical composition of the surface‐bound metallopolymers. The established photochemical technology platform for arbitrary spatially‐resolved metallopolymer surface designs enables the patterning of multiple metallopolymers onto solid substrates. This allows for the assembly of designer metallopolymer substrates.